Tin whiskers growing from inside walls of tin-plated transistor

Tin whiskers growing from inside walls of tin-plated transistor. Photo courtesy of NASA.

Tin/Lead Plated Wire

Tin & Lead Elements

Tin/Lead plated wire offers strong electrical conductivity, corrosion resistance and provides unsurpassed solderability of base metals that are not otherwise effectively soldered to. Tin/Lead plated wire is best in aeronautical and aerospace applications as the addition of lead prevents the forming of “tin whiskers”. Tin whiskers are the cause of electrical failure due to their growth and penetration of electrical cabling resulting in a short circuit.

MWS offers tin/lead plated wire in both bright (die-burnished) and matte electrodeposits. The tin to lead ratios offered are 95/5, 90/10 and 60/40 respectively.

Tin/Lead Plated Wire Properties

The appearance of tin/lead plating is very much a function of that of the bare wire. If the bare wire has a matte finish, the tin plating deposit will have more of a matte luster. If the bare wire has a bright finish, the tin plating will have a more lustrous appearance.

Tin/Lead Plated Wire Properties


  • MIL-P-81728
  • ASTM B579

Underplates Provided:

  • Electrolytic Nickel
  • Copper


  • 95/5 – 95% Tin 5% Lead
  • 90/10 – 90% Tin 10% Lead
  • 60/40 – 60% Tin 40% Lead

Finish Type:

  • Matte
  • Bright (Die-Burnished)